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  features  trenchfet  power mosfets  200  c junction temperature  pwm optimized applications  isolated dc/dc converters - primary-side switch  automotive - fan motors - 12-v boardnet - motor drives SUV90N06-05 vishay siliconix new product document number: 72112 s-03079?rev. a, 03-feb-03 www.vishay.com 1 n-channel 60-v (d-s) 200  c mosfet product summary v (br)dss (v) r ds(on) (  ) i d (a) 0.0052 @ v gs = 10 v 60 0.0072 @ v gs = 4.5 v 90 a d g s n-channel mosfet to-262 s d g top view SUV90N06-05 3 12 absolute maximum ratings (t c = 25  c unless otherwise noted) parameter symbol limit unit drain-source voltage v ds 60 gate-source voltage v gs  20 v  t c = 25  c 90 a continuous drain current (t j = 175  c) t c = 125  c i d 90 a pulsed drain current i dm 240 a avalanche current i ar 75 repetitive avalanche energy b l = 0.1 mh e ar 280 mj t c = 25  c 350 c maximum power dissipation b t a = 25  c d p d 4.3 w operating junction and storage temperature range t j , t stg - 55 to 200  c thermal resistance ratings parameter symbol limit unit junction-to-ambient (pcb mount) d r thja 40  junction-to-case r thjc 0.5  c/w notes a. package limited. b. duty cycle  1%. c. see soa curve for voltage derating. d. when mounted on 1? square pcb (fr-4 material).
SUV90N06-05 vishay siliconix new product www.vishay.com 2 document number: 72112 s-03079 ? rev. a, 03-feb-03 specifications (t j =25  c unless otherwise noted) parameter symbol test condition min typ max unit static drain-source breakdown voltage v (br)dss v ds = 0 v, i d = 250  a 60 gate-threshold voltage v gs(th) v ds = v gs , i d = 250  a 1 3 v gate-body leakage i gss v ds = 0 v, v gs =  20 v  100 na v ds = 48 v, v gs = 0 v 1  zero gate voltage drain current i dss v ds = 48 v, v gs = 0 v, t j = 125  c 50  a dss v ds = 48 v, v gs = 0 v, t j = 200  c 10 ma on-state drain current a i d(on) v ds  5 v, v gs = 10 v 120 a v gs = 10 v, i d = 30 a 0.0044 0.0052 a v gs = 4.5 v, i d = 20 a 0.0059 0.0072  drain-source on-state resistance a r ds(on) v gs = 10 v, i d = 30 a, t j = 125  c 0.0085  v gs = 10 v, i d = 30 a, t j = 200  c 0.0105 forward transconductance a g fs v ds = 15 v, i d = 30 a 30 s dynamic b input capacitance c iss 7560 output capacitance c oss v gs = 0 v, v ds = 25 v, f = 1 mhz 1050 pf reverse transfer capacitance c rss 570 total gate charge c q g 155 220 gate-source charge c q gs v ds = 30 v, v gs = 10 v, i d = 90 a 28 nc gate-drain charge c q gd ds gs d 44 turn-on delay time c t d(on) 15 25 rise time c t r v dd = 30 v, r l = 0.4  90 130 turn-off delay time c t d(off) v dd = 30 v, r l = 0.4  i d  90 a, v gen = 10 v, r g = 2.5  95 140 ns fall time c t f 105 150 source-drain diode ratings and characteristics (t c = 25  c) b continuous current i s 75 pulsed current i sm 240 a forward voltage a v sd i f = 90 a, v gs = 0 v 1.1 1.4 v reverse recovery time t rr 50 85 ns peak reverse recovery current i rm(rec) i f = 90 a, di/dt = 100 a/  s 2.7 5 a reverse recovery charge q rr 0.067 0.21  c notes a. pulse test; pulse width  300  s, duty cycle  2%. b. guaranteed by design, not subject to production testing. c. independent of operating temperature.
SUV90N06-05 vishay siliconix new product document number: 72112 s-03079 ? rev. a, 03-feb-03 www.vishay.com 3 typical characteristics (25  c unless noted) 0 2000 4000 6000 8000 10000 12000 0 6 12 18 24 30 0 4 8 12 16 20 0 60 120 180 240 300 0 50 100 150 200 250 0 20406080100 0.000 0.002 0.004 0.006 0.008 0 20 40 60 80 100 120 0 40 80 120 160 200 012345 0 50 100 150 200 250 0246810 output characteristics transfer characteristics capacitance gate charge transconductance on-resistance vs. drain current v ds - drain-to-source voltage (v) v gs - gate-to-source voltage (v) - drain current (a) i d - gate-to-source voltage (v) q g - total gate charge (nc) i d - drain current (a) v ds - drain-to-source voltage (v) c - capacitance (pf) v gs - transconductance (s) g fs 25  c -55  c 3 v t c = 125  c v gs = 30 v i d = 85 a v gs = 10 thru 5 v v gs = 10 v c iss c oss t c = - 55  c 25  c 125  c 4 v v gs = 4.5 v - on-resistance ( r ds(on)  ) - drain current (a) i d c rss i d - drain current (a)
SUV90N06-05 vishay siliconix new product www.vishay.com 4 document number: 72112 s-03079 ? rev. a, 03-feb-03 typical characteristics (25  c unless noted) drain source breakdown vs. junction t emperature avalanche current vs. time 0.0 0.5 1.0 1.5 2.0 2.5 - 50 - 25 0 25 50 75 100 125 150 175 200 on-resistance vs. junction t emperature source-drain diode forward voltage t j - junction temperature (  c) v sd - source-to-drain voltage (v) - source current (a) i s 100 10 1 0.3 0.6 0.9 1.2 v gs = 10 v i d = 30 a t j = 25  c t j = 150  c (normalized) - on-resistance ( r ds(on)  ) 0 50 55 60 65 70 75 80 - 50 - 25 0 25 50 75 100 125 150 175 200 t j - junction temperature (  c) t in (sec) 1000 10 0.0001 0.001 0.1 1 0.1 (a) i dav 0.01 i av (a) @ t a = 150  c (v) v (br)dss i d = 10 ma 100 1 i av (a) @ t a = 25  c
SUV90N06-05 vishay siliconix new product document number: 72112 s-03079 ? rev. a, 03-feb-03 www.vishay.com 5 thermal ratings 0 20 40 60 80 100 0 25 50 75 100 125 150 175 200 safe operating area v ds - drain-to-source voltage (v) 1000 10 0.1 1 10 100 limited by r ds(on) 0.1 100 t c = 25  c single pulse maximum drain current vs. case t emperature t c - ambient temperature (  c) - drain current (a) i d normalized thermal transient impedance, junction-to-case square wave pulse duration (sec) 2 1 0.1 0.01 10 -4 10 -3 10 -2 10 -1 1 normalized effective transient thermal impedance 10 0.2 0.05 0.02 single pulse duty cycle = 0.5 - drain current (a) i d 1 ms 10 ms 100 ms dc 10  s 100  s 1 0.1


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